3100 00450716 全國供應商、價格、PDF資料
3100 00450716詳細規(guī)格
- 類別:溫度調(diào)節(jié)器
- 描述:THERMOSTAT 3100 SERIES HERMETIC
- 系列:3100
- 制造商:Honeywell Sensing and Control
- 電路:-
- 開關溫度:-
- 封裝/外殼:圓柱形,帶安裝法蘭
- 安裝類型:底座安裝
- 薄膜 EPCOS Inc 徑向 CAP FILM 1UF 63VDC RADIAL
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 徑向 CONN EDGECARD 48POS R/A .156 SLD
- 溫度調(diào)節(jié)器 Honeywell Sensing and Control 圓柱形,帶安裝法蘭 THERMOSTAT 3100 SERIES HERMETIC
- 嵌入式 - FPGA(現(xiàn)場可編程門陣列) Microsemi SoC 84-LCC(J 形引線) IC FPGA MX SGL CHIP 24K 84-PLCC
- 配件 Phoenix Contact 84-LCC(J 形引線) PLUG LENGTH 25MM DIA 5MM WHITE
- 嵌入式 - 微處理器 Intel 132-PGA IC MPU I960JD 3V 50MHZ 132-PGA
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 132-PGA CONN EDGECARD 38POS .100 EYELET
- 薄膜 EPCOS Inc 徑向 CAP FILM 1000PF 100VDC RADIAL
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 徑向 CONN EDGECARD 56POS R/A .156 SLD
- 配件 TPI (Test Products Int) 圓柱形,帶安裝法蘭 REMOVABLE RIGHT ANGLE MIRROR
- 配件 Phoenix Contact 圓柱形,帶安裝法蘭 PLUG LENGTH 25MM DIA 6MM WHITE
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 圓柱形,帶安裝法蘭 CONN EDGECARD 38POS .100 EYELET
- 嵌入式 - FPGA(現(xiàn)場可編程門陣列) Microsemi SoC 208-BFQFP IC FPGA MX SGL CHIP 24K 208-PQFP
- Card Edge, Edgeboard Connectors Sullins Connector Solutions 208-BFQFP CONN EDGECARD 56POS R/A .156 SLD
- 薄膜 EPCOS Inc 徑向 CAP FILM 0.1UF 100VDC RADIAL